FR4

Our Capability

FR4

CIRCUIT / PANEL SIZE

	Standard	Advanced
Single Sided	Max. 510 x 610mm
Double Sided Non PTH	Max. 510 x 610mm
Silver Through Hole	Max. 510 x 610mm
PTH	Max. 457 x 610mm	Max. 610 x 1000mm
Multilayer	Max. 457 x 610mm	Max. 610 x 1000mm
Layer count	Up to 20	Up to 58

MATERIALS

	Standard	Advanced
FR1	Yes	Yes
FR2	Yes	Yes
CEM-1	Yes	Yes
CEM-3	Yes	Yes
FR4 (Standard & Hi-TG)	ITEQ, Kingboard, Shengyi, Nanya, Grace, Isola, Ventec, EMC	Nelco, Rogers, Panasonic, Taconic, others available on request
Polyimide	Ventec, Arlon, Nelco
Aluminium	Denka, Bergquist, Laird, Ventec, Doosan, Boyu	Denka, Bergquist, Laird, Ventec, Doosan, Boyu
Ceramic	Al2O3, AlN, SiN (DBC, DPC & AMB)	Al2O3, AIN, SiN (DBC, DPC & AMB)

Pre-pregs	106, 1080, 2113, 2116, 2125, 7628	106, 1080, 2113, 2116, 2125, 7628, 106NF, 1080NF
Other Materials	Please Enquire	Please Enquire

COPPER FOIL

	Standard	Advanced
Single Sided	½oz (18µm) – 2oz (70µm)	30oz (1050µm)*
PTH	½oz (18µm) – 6oz (210µm)	30oz (1050µm)*
Multilayer (Outer layers)	12µm – 6oz (210µm)	30oz (1050µm)*
Multilayer (Inner Layers)	½oz (18µm) – 6oz (210µm)	15oz (525µm)*
Metal Clad PCB	1oz (35µm) – 6oz (210µm)	30oz (1050µm)*
ASPECT RATIO	10:01	16:01
*Maximum copper thickness depends on design.

SURFACE FINISHES

	Standard	Advanced
Hot Air Solder Level	Yes	Yes
Lead Free Hot Air Solder Level	Yes	Yes
ENEPIG	Yes	Yes
EPAG	Yes	Yes
Immersion Gold (ENIG)	Yes	Yes
Immersion Silver	Yes	Yes
Immersion Tin	Yes	Yes
Hard Gold & Gold Finger	Yes	Yes
OSP	Yes	Yes

SOLDIER MASKS, IDENTS AND CARBON

	Standard	Advanced
Photoimageable (LPI) Solder Mask	Green, Blue, White, Black	Red, Orange, Purple, Grey & Others on request
Via Plugging	Yes	Yes
Peelable Solder Mask	Standard & Hi-Temp—Blue, Green, Red	Standard & Hi-Temp—Blue, Green, Red
UV Curable ident (Silkscreen)	White, Yellow, Black	Green, Red, Blue, Brown
Carbon Key Pads	Yes	Yes
Carbon Links	No	Yes

CNC DRILLING

	Standard	Advanced
Min. Finished Hole Size (Mechanical)	0.20mm	0.10mm
Min. Finished Hole Size (Laser)	0.10mm	0.05mm
Minimum Punched Hole Size	0.80mm	0.70mm

TOLERANCES

	Standard	Advanced
Track & Gap	±20%	±10%
Layer Registration	±0.10mm	±0.10mm

HOLES

	Standard	Advanced
Hole Diameter (PTH)	±0.075mm	±0.050mm
Hole Diameter (Non-PTH)	±0.10mm	±0.050mm
Hole Diameter (Punched)	±0.15mm	±0.10mm
Hole Location	±0.05mm

ETCHING

	Standard	Advanced
Track & Gap	±20%	±10%

SOLDER MASK

	Standard	Advanced
Via Plugging (100% Fill)	–20%	-10%
Via Plugging Hole Size	≤0.50mm	≤0.60mm
Registration	0.025mm	0.020mm
Solder Dam Width	Min. 0.15mm	Min. 0.10mm
Thickness Over Trace (Surface)	Min. 10µm	Min. 15µm
Solder Mask Pad Size	Min. 15µm

GENERAL

	Standard	Advanced
Maximum board thickness	6.00mm	10.00mm
Minimum board thickness	0.30mm	0.20mm
Minimum Track / Gap Inner layer	0.10mm	0.05mm
Minimum Track / Gap Outer layer (35µm)	0.10mm	0.05mm
Finished PCB Thickness	±10%
Routing Profile	±0.15mm	±0.10mm
V-Cut profile	±0.15mm	±0.10mm

ELECTRICAL TEST

	Standard	Advanced
% Tested (Open / Short test)	100%	100%
QFP Pitch	16mil (0.40mm)	12mil (0.30mm)
BGA Pitch	16mil (0.40mm)	12mil (0.30mm)
Connector Pitch	16mil (0.40mm)	12mil (0.30mm)

OTHER OPTIONS

	Standard	Advanced
AOI	All Multilayer	All Multilayer
Impedance Control	± 10%	± 5%
Solderability Testing	As standard	As standard
Ionic Contamination	On Request	On Request
Microsecion Reports	On Request	On Request
Hi-Pot Testing	On Request	On Request

ADVANCED TECHNOLOGIES

BLIND VIAS, BURIED VIAS, SEQUENTIAL LAMINATION, FLEX-RIGID MULTILAYERS, COPPER COIN INSERTS, CERAMIC INSERTS, DIRECT THERMAL EXCHANGE (DTE), HEAVY COPPER

SPECIAL REQUIREMENTS

PLATED SLOTS, EDGE PLATING, COUNTERSINKING, EDGE BEVELLING, JUMP SCORING, BARCODING, BACK DRILLING, CASTELLATED HOLES, OTHERS AVAILABLE ON REQUEST

LEAD TIMES: FAR EAST MANUFACTURE

Board Type	Manufacturing Lead Time
Quick Turn ≤ 5sqft	From 5 Days
Single Sided	10 – 20 Days dependant on volume
PTH	15 – 25 Days dependant on volume
Multilayer	15 – 30 Days dependant on volume & Technology

FR4