SEAMORE INTERNATIONAL LIMITED

Experience

the reliability

from our PCB Solutions

FLEXIBLE LOCAL SUPPORT

SUPPLY CHAIN MANAGEMENT

EFFICIENCY

Who we are

Seamore Internation is an independent and professional PCB sourcing company. We have an office in Hong Kong and a professional support team based in Southern China, making a total workforce in Asia of over 25 staff.

We bring many benefits to our customers, which includes competitive pricing, exceptional quality, on-time delivery, consolidated shipments, short lead times and flexible MOQs. Seamore partners with several core PCB manufacturers covering a broad range of technologies and provides various sizes of order quantities. We offer a “one-stop-shop” service by selecting the most suitable manufacturers to meet and exceed the customer needs. 
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METAL CLAD PCBS

The advantage of using metal clad material for PCB production as opposed to more traditional materials such as FR4 and CEM is down to the efficient removal of heat. The dielectric insulating material in metal clad materials is designed to have a much superior thermal conductivity than that of FR4, Most materials have a conductivity ranging from 1W/m-K to 9W/m-K, allowing for efficient heat removal.

CERAMIC PCBS - SUPERIOR THERMAL MANAGEMENT

Ceramic PCBs have received enormous attention from the industry as an effective solution to a range of electronic issues. The superior Thermal Conductivity of ceramics, to 180W/mK., being the leading reason that more and more industries are turning to ceramics for their PCB design.

Heat dissipation is the key advantage that Ceramic has over more conventional materials such as FR4 and Metal Clad PCBs. With components being placed directly on the boards, and no isolation layer, the flow of heat through the boards is far more efficient.

In addition to this, Ceramic material can withstand high operating temperatures (over 800°C) and has a very low CTE (Coefficient of Thermal Expansion), allowing for additional compatibility options for circuit design.

Daleba specialises in Alumina Oxide (Al2O3), Aluminium Nitride (AlN) and Silicone Nitride (SiN) using Direct Bonded Copper (DBC), Direct Plated Copper (DPC) and Active Metal Brazing (AMB) technologies.

MORE INFO OR A QUOTE?

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