- Unit 3801, 38/F., Tower 2, Metroplaza, 223 Hing Fong Road, Kwai Chung, N.T. Hong Kong
IMS
Our Capability
IMS
CIRCUIT / PANEL SIZE
| Standard | Advanced | |
|---|---|---|
|
Metal Clad PCB |
510 x 610mm, 457 x 610mm |
Larger sizes available for long boards |
MATERIALS
| Standard | |
|---|---|
|
Aluminium |
Denka, Ventec, Bergquist, Doosan, Laird, and more |
|
Other Materials |
Please Enquire |
COPPER FOIL
| Standard | Advanced | |
|---|---|---|
|
Metal Clad PCB |
1oz (35µm) – 4oz (140µm) |
Heavier weights achievable under consultation |
SURFACE FINISHES
| Standard | Advanced | |
|---|---|---|
|
Lead Free Hot Air Solder Level |
Yes |
Yes |
|
OSP |
Yes |
Yes |
|
Immersion Gold (ENIG) |
Yes |
Yes |
|
ENEPIG |
|
Yes |
|
Immersion Silver |
|
Yes |
|
Immersion Tin |
|
Yes |
SOLDER MASKS, IDENTS AND CARBON
| Standard | Advanced | |
|---|---|---|
|
Photoimageable (LPI) Solder Mask |
Green, White, Black, Red, Blue |
Orange, Purple, Grey & Others on request |
|
Peelable Solder Mask |
Standard & Hi-Temp—Blue, Green, Red |
Standard & Hi-Temp—Blue, Green, Red |
|
UV Curable ident (Silkscreen) |
White, Yellow, Black |
Green, Red, Blue, Brown |
|
Carbon Key Pads |
Yes |
No |
|
Carbon Links |
Yes |
No |
CNC DRILLING
| Standard | Advanced | |
|---|---|---|
|
Min. Finished Hole Size (Mechanical) |
0.60mm x Material Thickness |
Smaller considered on a case by case basis |
|
Max. Finished Hole Size (Mechanical) |
5.90mm |
Holes over 5.90mm diameter are routed |
|
Minimum Punched Hole Size |
1.0mm x Material Thickness |
|
|
Minimum Router Diameter |
1.6mm |
1.6mm |
TRACK WIDTH
| Copper Thickness | Minimum Width | |
|---|---|---|
|
|
1oz (35um) |
0.005″ (0.13mm) |
|
|
2oz (70um) |
0.006″ (0.15mm) |
|
|
3oz (105um) |
0.007″ (0.18mm) |
|
|
4oz (140um) |
0.008″ (0.20mm) |
|
|
6oz (210um) |
0.010″ (0.25mm) |
|
|
8oz (280um) |
0.015″ (0.38mm) |
|
|
10oz (350um) |
0.015″ (0.38mm) |
TRACK GAP
| Copper Thickness | Minimum Width | |
|---|---|---|
|
|
1oz (35um) |
0.005″ (0.13mm) |
|
|
2oz (70um) |
0.009″ (0.23mm) |
|
|
3oz (105um) |
0.012″ (0.30mm) |
|
|
4oz (140um) |
0.014″ (0.36mm) |
|
|
6oz (210um) |
0.020″ (0.51mm) |
|
|
8oz (280um) |
0.024″ (0.61mm) |
|
|
10oz (350um) |
0.030″ (0.76mm) |
MINIMUM TRACK TO PROFILE
| Standard | |
|---|---|
|
Scored |
0.50mm |
|
Routed |
0.40mm |
|
Punched |
One material thickness |
SOLDER RESIST
| Standard | ||
|---|---|---|
|
Soldermask |
The solder resist clearance around copper pads should be 0.1mm – this can be reduced to 0.05mm to maintain a 0.20mm solder dam |
|
|
Solder Dam Width |
Min 0.20mm |
|
|
Solder Mask Pad Size |
Min 0.30mm x 0.30mm |
|
|
Character Height (Text In Resist) |
For the purposes of legible text, a minimum character height of 0.2mm is recommended |
|
IDENT
| Standard | ||
|---|---|---|
|
Minimum Character Height |
1.20mm |
|
|
Minimum Character Width |
0.25mm |
|
|
Minimum Text Line Thickness |
0.25mm |
|
|
Ident Text and Line to Copper Pad |
0.20mm – No ident text or lines to encroach onto copper pads |
|
|
Minimum Distance to Board Profile |
0.50mm |
|
DRILLING & PUNCHING
| Drilled | Routed | |
|---|---|---|
|
Minimum Hole Edge to Circuit Profile |
1.0mm |
One material thickness |
|
Minimum Hole to Hole Edge |
1.0mm |
One material thickness |
|
Minimum Punched Profile Radius |
1.0mm |
|
ELETRICAL TEST
| Standard | Advanced | |
|---|---|---|
|
% Tested (Open / Short test) |
100% |
100% |
|
Hi-Pot Breakdown Test |
On Request |
On Request |
LEAD TIMES: FAR EAST MANUFACTURE
| Standard | Quick Turn | |
|---|---|---|
|
|
10-15 Days + Shipping |
10 Days + Shipping |
